The TPL Group’s Chip Scale™ Portfolio includes a broad array of patents and patent applications protecting fundamental technologies used in “wafer level packaging” (WLP). Chip Scale Portfolio technologies such as through-silicon via (TSV), “flip chip,” and “wrap-around” WLP are enjoying rapid market adoption for applications such as image sensors.
The Chip Scale Portfolio includes a combination of advanced packaging technologies from some of the premier names in the industry, such as ChipScale, Inc. and Schott Electronics GmbH; and continues to be supplemented by TPL Group innovations.
Founded in 1992 as Micro SMT, Inc., The TPL Group acquired ChipScale, Inc. in 2007. Best known for its Micro SMT® packaging solutions, ChipScale, Inc. continues to commercialize wafer level packaging technologies through extensive research, engineering, and development efforts.
Schott is a multinational, technology-based group developing and manufacturing specialty materials, components and systems for nearly 125 years to improve how people live and work. Schott commercialized a wafer level packaging technology for optical sensors and other applications known as OPTO-WLP that uses through-silicon via contacts and thin glass encapsulation. The TPL Group acquired Schott’s OPTO-WLP platform in 2008.
Alliacense makes the Chip Scale Portfolio accessible to innovative companies that provide products and services based on the application of cost-effective, small form-factor wafer level packaging solutions.
